'Fishface' wrote:
| Phil Weldon wrote:
|
| > I found my E4300 heatspreader to be flat and smooth, and the
| > Intel retail, boxed, stock heatsink/fan was pretty good also.
|
| The first and only Intel HSF I checked looked flat, but was distorted
| from pressing the copper center into the aluminum. This made it
| high along the outside edge. Since I did not have a piece of glass
| narrow enough to lap it, I scraped around the outside edge with a
| razor blade instead. I think might have helped, maybe! Anyway, I'd
| check it if I were you. The E2160 has an all aluminum HSF.
|
| Arctic Silver has interesting paste application instructions for
| various processors:
|
| http://www.arcticsilver.com/instructions.htm
_____
Interesting to note that 'Arctic Silver' seems to be moving away from
thermal compounds that contain silver particles. Epically after maintaining
for so long that the silver loaded grease was so superior. And after
claiming that 'Arctic Silver' thermal grease was not conductive or
electrically a problem! It seems they have moved away from performance
claims to elaborate application and removal instructions B^) I now favor
applying thermal grease with a single edge razor blade and go for a layer
that is just translucent. The razor edge is a good check for flatness, and
naturally leaves a thicker coat on depressed areas.
I've run only one set of tests for thermal compounds, and that was seven
years ago. But since then I've always considered 'Arctic Silver' a strong
competitor with snake oil. Below are my early comparison results - using a
Pentium III 1GHz 700 MHz 100 MHz FSB. For those who don't remember the
Alpha PEP66U heatsink, it was large for its time, over all about 5 inches X
2.5 inches X 2.5 inch ( 125 X 60 mm X 60 mm) with about 40 very thin fins
brazed into slots in the base plate, the whole of black anodized aluminum,
with two 60 mm fans in the top of an aluminum shroud covering three sides of
the fin block. Likely the best CPU heatsink/fan for its time. I've still
got three, and may use them with Peltier arrays to cool water prior to the
CPU water block - yeah, real soon now B^)
You can skip to the end if you can't stand the suspense as to the winner!
*** Thermal Compound Test***
Thermal compound test with Pentium III 700 @ 700 and 1.65 volts, Windows
2000, SETI@home
Alpha PEP66U heatsink and fan, ambient room temperature air entering
heatsink fan. Two internal fans in server case with one side open and 10 "
fan blowing room air directly at the CPU heatsink/fan/motherboard.
Motherboard is Abit BX6 rev. 2 modified to read actual CPU temperature from
on-CPU-chip thermal diode.
Mother Board Monitor version 4.17 used for monitoring; temperatures logged
at 30 second intervals.
Preparation of heatsink and FC-PGA surfaces for test:
Thoroughly wiped all visible traces of compound from both surfaces.
Thoroughly scrubbed both surfaces with acetone and cotton swab.
Dried both surfaces with cotton swab, checking to make sure no lint was
left.
Applied very thin layer of compound, but enough to ensure coverage of the
entire FC-PGA chip surface.
Mounted FC-PGA in Abit SlotKET!!! adaptor, then mounted Alpha PEP66,
pressing straight down and engaging clips. Alpha PEP66U was then removed to
check full contact with thermal compound. Cleaning and application was
repeated, and Alpha PEP66U was remounted.
#1. No thermal compound
Idle
Ambient room temperature: 27 C
Motherboard temperature: 35 C
CPU temperature: 32 C
SETI@home version 3.0
Ambient room temperature: 27 C
Motherboard temperature: 38 C
CPU temperature: 52 C
#2. RadioShack catalog number 276-1372 zinc oxide in silicone
Idle
Ambient room temperature: 26 C
Motherboard temperature: 32 C
CPU temperature: 26 C
SETI@home version 3.0
Ambient room temperature: 26 C
Motherboard temperature: 36 C
CPU temperature: 30 to 36 C
(Test run # 2 may be affected by the work unit; angle covered is 0)
#3. Alpha supplied thermal grease
Idle
Ambient room temperature: 24 C
Motherboard temperature: 30 C
CPU temperature: 25 C
SETI@home version 3.0
Ambient room temperature: 24 C
Motherboard temperature: 33 C
CPU temperature: 29 C - 35 C
#4. Land 'o Lakes unsalted butter, 72% butterfat:
Idle
Ambient room temperature: 26 C
Motherboard temperature: 32 C
CPU temperature: 26 C
SETI@home version 3.0
Ambient room temperature: 26 C
Motherboard temperature: 35 C
CPU temperature: 32 C - 40 C
#5. Arctic Silver for small areas:
Idle
Ambient room temperature: 25 C
Motherboard temperature: 32 C
CPU temperature: 28 C
SETI@home version 3.0
Ambient room temperature: 25 C
Motherboard temperature: 36 C
CPU temperature: 32 - 37 C
Normalizing to an ambient room temperature of 27 C
#1. No thermal compound at all: Room ambient
temperature: 27
Correction
factor: + 0
CPU
idle temperature = 32 C
CPU
and SETI@home = 50 C
#2. RadioShack zinc oxide/silicone, 276-1372: Room ambient temperature:
26 C
Correction
factor: + 1 C
CPU
idle temperature = 26 C
CPU
and SETI@home = 31 C to 37 C
#3. Alpha supplied thermal grease: Room ambient
temperature: 24 C
Correction
factor: + 3 C
CPU
idle temperature = 28 C
CPU
and SETI@home = 32 C - 38 C
#4. Land 'o Lakes unsalted butter (71% butterfat): Room ambient
temperature: 26 C
Correction
factor: +1 C
CPU
idle temperature = 27 C
CPU
and SETI@home = 33 C - 41 C
#5. Arctic Silver for small contact areas: Room ambient
temperature: 25 C
Correction
factor: + 2 C
CPU
idle temperature = 30 C
CPU
and SETI@home = 34 C - 39 C
#1. 32 C / 50 C
#2. 26 C / 34 C
#3. 28 C / 35 C
#4. 27 C / 37 C
#5. 30 C / 37.5 C
Ranked by average of low and high CPU temperature for SETI@home:
#2, #3, #4, #5, #1
Ranked by CPU idle temperature:
#2, #4, #3, # 5, #1
Overall rank from best to worst.
#2. RadioShack zinc oxide, 276-1372: CPU running SETI@home 31 C to 37 C
normalized
#3. Alpha supplied thermal grease: CPU running SETI@home 32 C to
38 C normalized
#4. Land o' Lakes unsalted butter: CPU running SETI@home 33 C to
41 C normalized
#5. Arctic Silver for small contact areas: CPU running SETI@home 34 C to
39 C normalized
#1. No thermal compound: CPU running SETI@home 50 C
normalized
Now to see if this experiment gives repeatable results.
Unfortunately, unable to locate Marmite, and no store here will admit to
stock the stuff.
October 11, 2000
11:03 PM
Miami, Florida USA
Phil Weldon
*** test results end ***
Phil Weldon
"Fishface" <invalid.DeleteThis@ddress.ok?> wrote in message
news:%ot3j.49174$Xg.9176@trnddc06...
| Phil Weldon wrote:
|
| > I found my E4300 heatspreader to be flat and smooth, and the
| > Intel retail, boxed, stock heatsink/fan was pretty good also.
|
| The first and only Intel HSF I checked looked flat, but was distorted
| from pressing the copper center into the aluminum. This made it
| high along the outside edge. Since I did not have a piece of glass
| narrow enough to lap it, I scraped around the outside edge with a
| razor blade instead. I think might have helped, maybe! Anyway, I'd
| check it if I were you. The E2160 has an all aluminum HSF.
|
| Arctic Silver has interesting paste application instructions for
| various processors:
|
| http://www.arcticsilver.com/instructions.htm
|
| >> Stay informed about: Core 2 Duo Retail HS/Fan 
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